1、 Equipment structure: 1. Operation mode: Left (right) hand operation mode
2. Silicon wafer size: 6-inch circular wafer
3. Process layout: meet customer process requirements
4. Automation level: Industrial computer control system automatically controls the process flow
5. Delivery and pickup method: manual entry and exit of the boat.
6. Appearance: One main unit, with a horizontal two tube main frame.
2、 Main technical parameters:
1. Effective diameter of heating furnace tube: suitable for 6-inch silicon wafers. It is compatible with 5-inch and 4-inch silicon wafers downwards.
2. Working temperature range: 200~800℃
3. Length and accuracy of constant temperature zone: 600mm，
4. Control mode: Unified process management by industrial computer
5. Vacuum degree: 2 * 10-4 Pa
